湖南益阳人，2020年博士毕业于东南大学MEMS教育部重点实验室。研究方向主要包括微纳传感器、MEMS/NEMS谐振器、MEMS集成与封装等。主持完成国家自然科学基金青年科学基金项目，主要参与了多项JW科技委项目、装发预研基金、国家自然科学基金面上项目等项目。在IEEE TCPMT、IEEE/ASME JMEMS、IEEE TIM、IEEE MEMS、IEEE ECTC、IEEE INERTIAL等行业主流期刊和国际会议上发表论文二十余篇；申请发明专利十余项，其中授权中国发明专利7项、授权美国发明专利1项。

学术论文：

[1]  Z. Su, B. Luo, L. Zhu, Z. Xu, H. Li and J. Shang, "Fused silica micro shell resonators by a wafer-level thermal reflow process," J. Microelectromech. Syst.,  vol. 34, no. 1, pp. 43-51, Feb. 2025.

[2]  B. Luo, Z. Su and J. Shang, "Quality factors in borosilicate glass shell resonators," IEEE Trans. Instrum. Mas., vol. 73, pp. 1–7, 2024, Art. no. 7500507. 

[3]   B. Luo, Z. Su and J. Shang, "Achieving 1 million quality factor in fused silica planar frame resonator (PFR)," IEEE Trans. Compon., Packag. Manuf. Technol., vol. 13, no. 5, pp. 757–760, May 2023. 

[4]   Z. Su, B. Luo, Q. Tang, L. Zhu and J. Shang, "Micromachining fused silica micro shell resonator with quartz glass mold by thermal reflow," in Proc. IEEE 36th Int. Conf. Micro Electro Mech. Syst. (MEMS), Munich, Germany, Jan. 2023, pp. 889–892. 

[5]  S. Han, Z. Su, Y. Zhang, B. Luo and J. Shang, "Three-dimensional digital reconstruction geometric analysis for fused silica microshell resonators," IEEE Trans. Instrum. Meas., vol. 71, pp. 1–7, Sept. 2022, Art. no. 7504707. 

[6]  B. Luo, Z. Su and J. Shang, "Glass molding for microstructures," in Proc. IEEE Int. Symp. Inertial Sensors Syst. (INERTIAL), Avignon, France, May 2022, pp. 1–2.

[7]   L. Xu, B. Luo, J. Shang, Z. Su, S. Han and Y. Zhang, "Study on the effect of assembly errors on the electrostatic tuning ability in micro umbrella shell resonators," in Proc. 22nd Int. Conf. Electron. Packag. Technol. (ICEPT), Xiamen, China, Sept. 2021, pp. 1–5.（Best Student Paper Award）

[8]   W. Li, C. Xing, J. Zhang, Z. Wang, Z. Su, B. Luo and J. Shang, "Glass reflow and thermo-mechanical stress simulation for through glass via in glass-silicon composite interposer," in Proc. 22nd Int. Conf. Electron. Packag. Technol. (ICEPT), Xiamen, China, Sept. 2021, pp. 1–4.

[9]   J. Zhang, J. Shang, B. Luo and Z. Su, "Micro fountain-like resonators," in Proc. IEEE 69th Electron. Compon. Technol. Conf. (ECTC), Las Vegas, NV, USA, May 2019, pp. 890–895.

[10] B. Luo, J. Shang, Z. Su, J. Zhang and C. -P. Wong, "Height adjustment of 3-D axisymmetric microumbrella shells for tailoring wineglass frequency," IEEE Trans. Compon., Packag. Manuf. Technol., vol. 9, no. 3, pp. 567–574, Mar. 2019.

[11]  B. Luo, M. Ma, M. Zhang, J. Shang and C. -P. Wong, "Composite glass-silicon substrates embedded with microcomponents for MEMS system integration," IEEE Trans. Compon., Packag. Manuf. Technol., vol. 9, no. 2, pp. 201–208, Feb. 2019.

[12]   Z. Su, J. Shang, B. Luo and C. -P. Wong, "Study on an improved wafer level fabrication process to achieve size uniformity for micro glass shell resonators," in Proc. IEEE 68th Electron. Compon. Technol. Conf. (ECTC), San Diego, CA, USA, May 2018, pp. 962–966.

[13]    罗斌, 尚金堂. 微玻璃半球壳体谐振子的设计、制备与表征[J]. 导航定位与授时, 2017, 4(02): 79–85. 

[14]  B. Luo, J. Shang and Y. Zhang, "Hemispherical glass shell resonators fabricated using chemical foaming process," in Proc. IEEE 65th Electron. Compon. Technol. Conf. (ECTC), San Diego, CA, USA, May 2015, pp. 2217–2221.

发明专利：

[1] 尚金堂, 罗斌. 一种石英玻璃晶圆能量损耗的评估方法与测量结构及其制备方法: 中国发明专利, CN 202310563076.4 [P].  2023-05-18.

[2] 尚金堂, 罗斌.一种MEMS平面谐振器结构及其制备方法: 中国发明专利, CN 202310563075.X [P]. 2023-05-18.

[3]  尚金堂, 罗斌. 一种玻璃多曲面壳体结构及其制备方法: 中国发明专利, CN 202111246087.7 [P]. 2021-10-26.

[4]   J. Shang, B. Luo, Micro Three-Dimensional Shell Resonator Gyroscope: U.S. Patent 10,527,422 B2 [P]. 2020-01-07. 

[5]   尚金堂, 罗斌, 张瑾. 硅基微壳体谐振器及其制备方法: 中国发明专利, ZL 201611030181.8 [P]. 2019-11-08. 

[6]   尚金堂, 罗斌, 张瑾. 微壳体谐振器及其谐振子制备方法: 中国发明专利, ZL 201610814217.5 [P]. 2019-07-26. 

[7]  尚金堂, 罗斌, 梁栋国, 苏兆喜. 集成双维电极的带非常规边缘的微三维轴对称振动传感器: 中国发明专利, ZL 201710133995.2 [P]. 2019-05-17. 

[8]  尚金堂, 罗斌, 张瑾. 具有抗冲击能力的壳体谐振器: 中国发明专利, ZL 201610375804.9 [P]. 2019-04-09. 

[9]  尚金堂, 罗斌, 张瑾. 一种双壳体谐振子及其制备方法: 中国发明专利, ZL 201610442909.1 [P]. 2018-11-16. 

[10]  尚金堂, 罗斌. 微玻璃半球谐振陀螺及其圆片级制备方法: 中国发明专利, ZL 201510963681.6 [P]. 2017-03-15. 

邮编 : 210044

通讯/办公地址 : 临江楼A709

邮箱 : luob@nuist.edu.cn

2013.9 -- 2020.9
东南大学       微电子学与固体电子学       博士研究生(硕博连读)       工学博士

2009.9 -- 2013.6
东南大学       电子科学与技术       本科       工学学士

2020.11 -- 2024.12

东南大学      电子科学与工程学院(2020-2021)/集成电路学院(2022-2024)      博士后/助理研究员

MEMS/NEMS传感器

石英玻璃振动式微惯性器件

高Q值纳米谐振器

MEMS集成及封装