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Affilication of Author(s):电子与信息工程学院

Patent Coverage:国内

School Sign:第一单位

Type of Patent:Invent

State of Patent:Authorized patents

Application Number:2023105759120

Authorization Number:CN116299305B

Service Invention or Not:no

Application Date:2023-05-22

Authorization Date:2023-08-15

Application Date:2023-05-22

Authorization Date:2023-08-15