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Affilication of Author(s):电子与信息工程学院

Patent Coverage:国内

School Sign:第一单位

Type of Patent:Invent

Application Number:202311818617X

Authorization Number:CN117475242B

Service Invention or Not:no

Application Date:2023-12-27

Authorization Date:2024-03-08

Application Date:2023-12-27

Authorization Date:2024-03-08