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高增益波导缝隙耦合喇叭阵列天线

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  • Affilication of Author(s):电子与信息工程学院

  • Patent Coverage:国内

  • School Sign:第一单位

  • Type of Patent:实用专利

  • Application Number:201520013164.8

  • Service Invention or Not:yes

  • Application Date:2015-01-09

  • Publication Date:2015-02-09

  • First Author:于兵
  • 于兵

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