Affiliation of Author(s):电子与信息工程学院
Journal:IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS
Funded by:“973”计划
Document Code:25934
Volume:23
Issue:12
Page Number:677-679
Translation or Not:no
Date of Publication:2013-11-28
Affiliation of Author(s):电子与信息工程学院
Journal:IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS
Funded by:“973”计划
Document Code:25934
Volume:23
Issue:12
Page Number:677-679
Translation or Not:no
Date of Publication:2013-11-28